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| GaN boost from PCB packaged power project A project in the UK is developing packaged power functions such as a half bridge with pre-packaged gallium nitride (GaN) devices for lower cost, weight and size. The Pre-packaged Power devices for PCB Embedded Power (P3EP) project has been developing capabilities to support PCB-embedded power systems. It is using intelligent GaN devices from Cambridge GaN […] The post GaN boost from PCB packaged power project appeared first on eeNews Europe. Read the full article on Smart2.0 »    |
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GaN boost from PCB packaged power project