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| SEMIFIVE and Synopsys to develop chiplet platform for multi-die designs HPC chiplet platform helps meet PPA goals and accelerate time-to-market for multi-die designs to address growing compute demands. The post SEMIFIVE and Synopsys to develop chiplet platform for multi-die designs appeared first on eeNews Europe. Read the full article on Smart2.0 »    |
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SEMIFIVE and Synopsys to develop chiplet platform for m...